3D-IC Summer School

February 6-8, 2012

3D Integrated Circuits: Technology and Information Processing

The Third IEEE CASS Summer School 2012 is part of a series of Summer Schools planned to happen in Region 9, moving each year between latin-american countries. This third edition will take place in Buenos Aires, Argentina, hosted by Universidad Nacional del Sur (UNS). This event will provide students and researchers with a grounding in the core subjects related to 3D Integrated Circuits, and also stimulate discussion in the potential applications of this technology in the area of sensory information processing. The school is intended for graduated students and researchers from neighboring disciplines, as well as industrial researchers and practitioners who want to discover more about this area.


  • Andreas G. Andreou, JHU, USA, 3D Sensory Systems
  • Pedro Julián, UNS, ARG, 3D Nonlinear Processors
  • Subramanian S. Iyer, IBM, USA, 3D Technology
  • Ricardo Reis, UFRGS, BRA, 3D Design
  • Shihab Shamma, UMD, USA, Neural Signal Processing
  • Eduardo Nebot, USydney, Field Robotics
  • Favio Masson, UNS, ARG, Particle Filters
  • Pablo Mandolesi, UNS, ARG, 3D Imagers I
  • Martin Di Federico, UNS, ARG, 3D Imagers  II
  • Liliana Fraigi, INTI, ARG, Systems on Package
  • Alfonso Chacon-Rodriguez, TEC, CR, Sound Processors
  • Tezzaron Semiconductor, USA, 3D-ICs
  • Angel Rodriguez Vazquez, CNM, SPAIN, 3D Smart Imagers

Registration Opens December 1

Venue: NH Crillón, Av. Santa Fé 796, Buenos Aires